MiP display technology: Breaking through traditional boundaries and reshaping the visual future

At a time when display technology is rapidly iterating, a silent change is quietly brewing in the industry. MiP (Micro LED-in-Package) devices, as a representative of substrateless chip display technology, quickly seize the focus of the industry with their disruptive innovative architecture and unique advantages, and become a potential star to rewrite the display technology landscape. How exactly does this technology stand out in the fierce competition? Let us deeply analyze the mystery behind it.
MiP (Micro LED-In-Package) technology is a milestone in the field of chip-level packaging, and its process flow embodies the wisdom of cutting-edge technology.
MiP（Micro LED-In-Package）技术堪称芯片级封装领域的里程碑，其工艺流程凝聚着尖端科技的智慧结晶。This technology uses massive transfer technology to strip Micro LED three-color light-emitting chips with a size below 50 microns from the substrate, accurately transfer and fix them on the carrier board, and then sequentially carry out packaging, cutting, detection and light mixing process. This series of operations may seem step-by-step, but in fact every step has a hidden mystery.

The massive transfer process requires accurate placement of tens of thousands of tiny chips on the carrier board to form an orderly array; fan-out packaging uses semiconductor technology to finely amplify the electrode pins; the cutting and sorting process requires accurate cutting of the packaged carrier board into individual discrete devices and testing their optoelectronic properties one by one; finally, the device is transferred to a PCB or glass substrate with the help of a die bonder. Each process has strict requirements on precision and stability, demonstrating the ultimate level of modern manufacturing technology.
Although MiP technology has unlimited prospects, it still faces many difficult challenges on the road to large-scale industrialization.
尽管 MiP 技术前景无限，但在迈向大规模产业化的道路上，它仍面临着诸多棘手挑战。First of all, the binning process of Micro LEDs is very difficult. It is not only costly, but also because a single MiP chip integrates three LED chips, it is extremely difficult to ensure that the brightness and light color of chips from the same batch are highly consistent.
此外，两道封装工艺使得色光从发光面到出光面需穿越三种不同材质，复杂的折射与全反射极易催生麻点现象，影响显示效果。The increase in the number of packaging layers brings more interfaces. The difference in thermal expansion coefficients of different materials will cause interface stress imbalance when heated, resulting in separation of the packaging layers and uneven darkness and brightness at large angles. In addition, MiP device processes are complex and equipment precision requirements are extremely high. Currently, the cost remains high, the mass production yield needs to be improved, and the technological maturity still needs time to polish.
In-depth analysis of MiP device display technology" src="https://www.52dp.cn/d/file/p/2025/05-27/52dp_1748311983748.jpg" />| Promising future: MiP lights up a new journey for display technology
Despite the constant challenges, the application blueprint of MiP technology is slowly unfolding.
尽管挑战不断，MiP 技术的应用蓝图却已徐徐展开。Its spacing ranges from P0.4 ultra-micro spacing to P2.0 regular spacing. In high-end fields such as virtual shooting, high-end theaters, wearable devices and transparent displays, MiP technology has begun to show its brilliance with its excellent display effects. As the cost of upstream chips gradually decreases, MiP products are steadily moving towards consumer markets such as home displays and car screens.
行业预测，2025 年后，产业链协同效应将全面爆发，综合成本有望大幅下降，推动高端显示市场规模持续扩张。By then, MiP technology will no longer be limited to professional fields, but will enter thousands of households, bringing an unprecedented visual feast to users.
| With its innovative packaging architecture and process integration, MiP technology cleverly balances the performance requirements and industrialization costs of micro-pitch displays. It is undoubtedly an important technical path for LED displays to move towards the ultra-high definition era.
MiP 技术凭借创新的封装架构与工艺整合，巧妙平衡了微间距显示的性能需求与产业化成本，无疑是 LED 显示迈向超高清时代的重要技术路径。With the continuous breakthroughs of technology and the increasing improvement of the industrial chain, MiP will surely bring us a clearer and more shocking visual experience, open up a new track for LED display packaging technology, and write a new chapter in the display industry.