Zhaochi integrated optical communication chip production line opens a new chapter in the field of op

On December 20, 2024, Zhaochi Group announced a major strategic plan to build an annual output of 100 million optical communications semiconductor laser chips (Phase I), and began to build gallium arsenide and indium phosphide compound semiconductor laser wafers. Manufacturing production line. Once the news broke out, it quickly attracted countless attention from the industry. No one expected that in just seven months, Zhaochi Integration, a subsidiary of Zhaochi Group, completed the miraculous leap of the Guangtong chip production line from scratch at an amazing Zhaochi speed. Now, this product line is officially launched, which undoubtedly marks a milestone and key step taken by Zhaochi Integration in the field of high-end semiconductors.

Breaking the situation: Precise strategic layout and efficient team formation At present, global data centers are booming, and AI computing power is exploding. These two trends have caused the market demand for optical communication chips to rise sharply. Zhaochi Integration keenly captured the trend of this industry and decisively anchored its strategic focus on the optical communication chip track. Since the project announcement was released, intensive preparations have been launched within the company.

In terms of team building, Zhaochi Integration quickly recruited top experts in the semiconductor field from home and abroad to form a core technical team. The team members have diverse professional backgrounds, covering all technical fields of optical chip production such as chip design, epitaxial growth, process, chip testing, and chip reliability, providing a solid talent guarantee for the advancement of the project. At the same time, equipment evaluation work also started simultaneously. The technical team conducted several rounds of rigorous and detailed technical demonstrations on epitaxial growth equipment, chip process equipment, testing equipment, reliability equipment, etc. provided by top suppliers around the world. They considered performance, compatibility, stability and other dimensions, and finally used high performance and high compatibility as strict standards to accurately complete the equipment selection work to ensure that the introduced equipment can meet the needs of large-scale and high-quality production in the future.

Overcoming difficulties: Overcoming numerous difficulties and achieving technological breakthroughs On the eve of the Spring Festival in 2025, the first batch of core equipment was successfully entered into the 100-level workshop integrated by Zhaochi. In order to enable the project to be implemented as soon as possible, the engineers voluntarily gave up their vacations and raced against time to carry out equipment installation and system joint debugging under extremely strict production standards. As the second quarter comes, the production line enters a critical stage of process debugging, which is also one of the most difficult periods in the entire project advancement process. Technical problems such as epitaxial growth uniformity and grating etching accuracy lie in front of the team, and each problem is like an insurmountable mountain.

Faced with the challenge, the technical team did not flinch at all. They took root in the workshop and carried out hundreds of parameter optimization experiments to repeatedly refine and debug every production link and every technical parameter. Hard work paid off. After countless days and nights of unremitting efforts, the team successfully broke through key technical bottlenecks such as epitaxial growth uniformity and grating etching accuracy. By June, the first batch of epitaxial wafers were successfully lit up, and all key technical indicators accurately met the design goals. This achievement laid a solid foundation for subsequent mass production work.

Outlook: Planning a full series of products and laying out cutting-edge technologies At present, Zhaochi's integrated optical chip production line has successfully achieved the mass production capacity of 25G DFB laser chips. This achievement marks that the company has officially entered a new stage in mass production of optical chips. stage. Based on the existing technical foundation and market demand research, the company has formulated a highly forward-looking product plan. It plans to launch 50G DFB and 100G VCSEL chips in 2026, focusing product applications on the passive optical network (PON) and data center short-distance optical interconnection module markets, aiming to meet the needs of high-density and low-latency in these fields. Urgent need for data transmission.

What is even more eye-catching is that Zhaochi Integrated has demonstrated excellent forward-looking vision in technology research and development, and is simultaneously advancing the layout of silicon photonics and photonic integrated circuits (PIC) technologies. The company's goal is to build highly integrated optoelectronic solutions for co-packaged optical (CPO) architectures. This solution will focus on key technologies such as optoelectronic collaborative design and heterogeneous integration processes, and strive to achieve major technological breakthroughs, thereby helping customers calmly cope with the power consumption, bandwidth and density challenges in 800G/1.6T ultra-high-speed interconnection scenarios. Provide high-performance core optical engine support for the next generation data center optical interconnection infrastructure.

From project establishment to product line launch, Zhaochi Integration vividly interprets the impressive speed of China core with practical actions. The birth of this optical chip production line not only fills the gap in Zhaochi's integrated business in the field of optoelectronic electronics, but also injects new vitality and impetus into the independent and controllable development goal of domestic high-end optical chips. With the launch of the first batch of customer sample verification work, Zhaochi Integration is moving at full speed towards its ambitious goal of becoming a global optical communications core chip supplier. It is expected to write its own glorious chapter on the stage of the global optical communications market.

About Zhaochi Integration Jiangxi Zhaochi Integrated Technology takes laser chip technology as its core competitiveness and carefully builds a full-chain industrial layout of chip design-epitaxial growth-chip manufacturing-chip testing-reliability, providing intelligent driving, high-end manufacturing and digital communication The industry provides strong technical empowerment. The company's business covers a wide range of application fields such as consumer electronics, optical communications, laser radar, low-altitude economy, intelligent optical interconnection, industrial processing and medical equipment. In the future, Zhaochi Integration will continue to deepen its technology research and development, and is committed to breaking through the design and manufacturing technology of high-power, high-speed, low-power, and high-reliability laser chips, building them into the company's core competitiveness, and making every effort to promote the industrialization of laser chips, achieving import substitution, and contributing more strength to the vigorous development of the optoelectronic industry.