Technical Chapter| What do you know about LED display device packaging technology?

After more than 40 years of development, the packaging of LED display devices has gone through development stages such as Lamp in-line, SMD(Surface Mounted Devices) surface mounting, and COB(Chip on Board) integration, and has gradually moved towards miniaturization of pixel pitch. In the era of Mini LED and Micro LED display, which packaging technology has the advantage?

LED(Light-emitting diode) packagingrefers to the packaging of light-emitting chips, which is different from the packaging of integrated circuits. LED packaging not only requires the abilityto protect the wick, but also allowslight and heat dissipation. Therefore, LED packaging has special requirements for packaging materials. With the development of the market and the increasing demand for chip power, new and higher requirements have been put forward for the optical, thermal, electrical and mechanical structures of LED packages. In order to effectively reduce the package thermal resistance and improve light efficiency, new technical ideas must be adopted for package design.

The innovation of LED display device packaging technology has experienced in-line packaging and surface mount packaging that appeared after the 1990s, and the popular SMD surface mount packaging that appeared around 2010. The advantages of in-line pin-type (Lamp) are still used in some outdoor displays, such as mature technology, weather resistance, and high brightness. SMD uses Surface Mount Technology (SMT) and has a high degree of automation. Compared with pin-based packaging technology, it performs well in terms of brightness, consistency, reliability, viewing angle, appearance, etc., and is especially suitable for indoor and outdoor full-color display applications. It has unique advantages in viewing application scenarios from a long distance.

Based on the mature SMD process, a new product has been innovated-N-in-1 LED(Integrated Matrix Devices (IMD)). Currently, the typical method is in the 2*2 form, that is, 4-in-1. MIP(Micro LED in Package) is a new packaging architecture based on Micro LEDs. It is a technological innovation for traditional SMD products. By separately packaging a large-area entire display panel, it realizes the organic combination of Micro LEDs and discrete devices, making it It can greatly improve the yield in a smaller area, and at the same time, it can use the original production line equipment to create new products to effectively reduce costs. It will be widely used in indoor high-performance direct display products.

As people put higher and higher resolution requirements on indoor and outdoor LED displays and the distance between display dots is gradually miniaturized, traditional single packages are gradually becoming integrated packages. Nowadays, the new COB chip-level packaging form is recognized as the future development direction of small-pitch and ultra-micro pitch direct display products to solve the problem of batch mounting of small and micro size LED chips.

Schematic comes from the network

Each packaging technology has its own advantages and limitations, and there will be different choice directions at different levels of consideration. Among them, the integration of MIP and COB dual technology routes will form complementary advantages to promote the& industrialization and marketization of Mini Micro LED displays.

To achieve the popularization of micro-pitch displays, yield and cost control are the key to large-scale mass production. At present, the best way to meet yield and cost optimization at the same time is to start with the packaging process. The era of Mini Micro LED display has arrived. In these two aspects, our Lampu Video has experienced long-term R &D investment and profound technical accumulation.

COB Black Elf Series

MIP Black Crystal Series

As a company that started SMD, we have a full range of cost-effective SMD product solutions. At the same time, we not only provide high-brightness and small-pitch MIP products to the market, but also lead the market in terms of fully flip-chip common cathode COBs and spatial pixel COBs. In terms of COB R & D, the company began to deploy in early 2020 and has currently obtained a number of national patents. In particular, spatial pixel technology has won the Shenzhen Special Technology Research Award.

New display technologies promote the development of new packaging routes and also promote our efforts to create cost-effective products with excellent display effects. The 20th National Congress of the Communist Party of China raised the strategic significance of scientific and technological innovation to a new level. In the field of new displays, our Lamp Video will also actively meet market challenges, continue to innovate, overcome difficulties, and create diverse products to meet the needs of users and the market.