COB technology helps display enter the era of p0.XXmm HD

As people's requirements for display effects become more and more high-definition, 5G+8K ultra-high definition continues to develop. In the LED display industry, small-pitch LEDs have also begun to break through the upper limit of ultra-high definition display. Small-pitch LEDs and even micro-pitch LED displays have become an inevitable trend in the development of the industry. Not long ago, the P0.3 Micro LED screen unveiled at ISE 2023 used flip-chip COB packaging technology to refresh the industry's innovative technology, which made many people think more about COB technology. As we all know, the smaller the spacing of LED displays, the higher the resolution. This is why Micro LEDs and Mini LEDs on the scale of microns are called the future of display technology. The ideal technology for making Micro LEDs and Mini LED products is COB integrated packaging + full flip chip LED chip technology combination, but it is not easy to achieve Micro LED products at P0.3 and below. COB's support for ultra-high-definition displays has become the development direction of the display industry. It can be said that the development of COB technology is a key factor leading LED displays into the era of p0.Xmm. So why does COB, which is mainly used in the packaging process, have such a great influence? This must also be combined with the production process and development history of LED displays.

Compared with other packaging technologies, COB technology is called million-level technology, which means that in 1 million display pixels, products using COB technology can control pixel failure points within 1-9. The packaging technologies of LED display screens mainly include DIP packaging technology, SMD packaging technology, IMD packaging technology, and COB technology. Among them, SMD packaging technology is mature and stable and has strong cost advantages. Therefore, it is the current LED display screen industry. Mainstream packaging technology. However, the pixel failure rate of SMD technology is only 10,000, which is far from meeting the requirements of small spacing and ultra-high-definition display. Flip-chip COB technology can greatly increase the current density, improve the stability and light efficiency of lamp beads, and the flip chip structure can It can well meet such needs, simplify the production process, better display effects, and achieve chip-level spacing, which has reached the level of Micro LEDs.

As a million-level packaging technology, COB technology not only helps displays enter the era of p0.Xmm HD, but also innovates the industrial chain with a new attitude. This is reflected in the differences between COB technology production process and production line equipment layout and SMD packaging technology. Very large, COB technology integrates and simplifies the production processes of packaging companies and display manufacturers, and the production process is easier to organize and control. In addition, COB technology has strong advantages in terms of heat dissipation effect, effective use of space, reduction of moire patterns, and post-maintenance.

Although COB technology has strong advantages at the technical level, COB products are currently mainly aimed at the mid-to-high-end commercial display market, and have not achieved a high market penetration rate. Looking back a few years ago, COB's market share is even less than 10%. From the related research and development of COB technology by some companies, we can actually see that flip-chip COB packaging technology is currently the advanced direction of COB screen companies. As an important prerequisite for Micro LED products, flip-chip COB packaging technology has advantages in electrical connectivity, surface flatness and other aspects are more superior.

At present, Lianjian Optoelectronics has complete COB R & D, design, manufacturing, and after-sales maintenance capabilities. It has been able to achieve chip-level rework of COB finished modules, and the process yield rate has reached 99.99%, ranking in the industry leading position. At the recent ISE exhibition, Lianjian Optoelectronics also exhibited its series of micro-pitch products such as VT0.7 and VTII0.9 in the COB area. This series of products uses a full flip-chip COB package and cooperates with Lianjian Optoelectronics independently developed Vmini micro-pitch display technology and micron-level light-emitting chips enable LED displays to present a darker black field and higher contrast.

Abbison's second-generation flip-chip COB micro-pitch display CL series products have won many awards, and this product has been widely used in high-end conference rooms, control rooms, radio and television studios and other scenarios. Due to the use of flip-chip COB packaging technology, the product is stable and reliable, can easily cope with various environmental tests, and continue to operate stably.

As the industry leader in COB display technology, Xida took the lead in completing the development of flip-chip COB technology as early as 2013. In 2017, it was also authorized to license relevant invention patents, completing the iterative upgrade from formal COB to flip-chip COB technology. Xida also released the world's first 0.4mm ultra-high-definition micro-pitch flip-chip COB 2K mosaic display in the national special project for the development and application of key technologies for ultra-high-density small-pitch LED display during the national 13th Five-Year Plan. At the beginning of this year, Xida Electronics held a promotion and cooperation and exchange conference for its 2023 all-flip-chip COB innovative products in Hainan. At the conference, Xida Electronics demonstrated its multiple integrated flip-chip COB integrated packaging processes and pixel doubling core patents technology Mini LED products, and revealed that based on the flip-chip COB integrated packaging supporting industry chain, Xida has completed 75-inch, 85-inch, 98-inch, 120-inch and other series products have been developed and have full mass production capabilities. This product is first released ahead of international LED display giants such as Samsung and Sony, and the full set of technology has reached the international leading level.

The penetration rate continues to increase, and the competitiveness of domestic manufacturers is strengthened

COB packaging technology has a high threshold and low price sensitivity due to its application field in the high-end market. Therefore, COB products are still dominated by international manufacturers. However, with the advancement of technology in recent years, the competitiveness of domestic manufacturers 'products has also been rapidly improving.

If the main growth of the company's COB business layout depends on the improvement of industry penetration and its own share, the improvement of industry penetration comes from cost reduction. In the future when COB technology continues to make breakthroughs, the cost of COB packaged displays will gradually decrease, and more manufacturers will have the opportunity to make corresponding arrangements in the COB market. In addition to market demand and technological advantages, COB technology also enjoys the best advantage in national government policies, including receiving many support conditions such as national key scientific research projects and new display development directions. In general, the market penetration rate of COB products will be further improved in the future. With the active deployment of major screen companies, the rise of China manufacturers in the COB field is just around the corner.