What are the LED chip packaging materials used to package COBs?

Organosilicon, or organosilicon compound, refers to a compound containing a Si-O bond and at least one organic group is directly connected to a silicon atom. The key properties of silicone products include excellent temperature resistance, that is, structural stability under high and low temperatures; good weather resistance, that is, it is not easy to be decomposed by ultraviolet light and ozone in the atmospheric environment; stable electrical insulation properties, that is, the product has low dielectric loss, high voltage resistance, excellent surface resistivity, etc. Epoxy resin refers to an organic polymer compound containing two or more epoxy groups in the molecule. It has high mechanical properties, strong cohesion, dense molecular structure, excellent adhesive properties, small curing shrinkage, small internal stress, insulation, excellent corrosion resistance and heat resistance. The key properties of the above-mentioned silicone and epoxy resin materials meet the important performance requirements in the bonding and encapsulation of electronic components, and play an important role in the reliability and service life of packaged electronic devices, promoting the widespread application and continuous development of organic silicone and epoxy resin materials in the field of electronic and electrical packaging.

In addition to meeting the high precision and device reliability requirements of chip packaging, LED chip packaging also needs to ensure the realization of optical properties, so the packaging process requirements are extremely strict. As one of the core materials in the LED chip packaging process, on the basis of basic functions such as bonding, fixing, and encapsulation, it also needs to have refraction, light transmission, electricity conduction, heat conduction, water vapor barrier, shock absorption and impact resistance, etc. Various composite functions, product performance and quality stability have an important impact on the light efficiency, reliability, and life of LED devices, modules and end products, which in turn determines its higher added value of the product.

The main products of electronic adhesives for LED chip packaging include high refractive index silicone packaging glue, Mini LED silicone packaging glue, silicone crystal fixing glue, electronic epoxy packaging glue, LED epoxy molding compound, conductive silver glue, etc., which have been widely used in new display, semiconductor general lighting, semiconductor component packaging, aerospace and other fields. It is mainly used in the encapsulation and die bonding process of LED chip packaging. The series of products can be applied to different types of chips such as flip chip structure, formal structure, and vertical structure, as well as various new LED chip packaging methods such as SMD, POB, COB and CSP. Specific application scenarios examples of the products are as follows:

The application performance system of electronic packaging materials is relatively complex, mainly including four categories: optical performance, reliability, process operability and stability. During the optimization of a particular property, reactions between polymer components in the formulation may adversely affect other performance indicators. Therefore, there is a high technical threshold for balancing and jointly optimizing various performances.

With the continuous development of downstream application fields such as new displays, semiconductor general lighting, and semiconductor dedicated lighting, the LED chip packaging process has evolved rapidly, forming a market structure in which multiple packaging processes coexist. The development trends of packaging technologies such as thinness, micro-spacing, and high light efficiency continue to increase the performance requirements of electronic packaging materials.

At the same time, with the continuous enrichment of packaging forms, chip structures, and substrate types, downstream customers 'packaging process technical routes are constantly updated, putting forward higher requirements for the richness of product reserves of electronic packaging material manufacturers. The technical difficulty of electronic packaging materials lies in the need to transform downstream customers 'application needs for electronic packaging materials from both process and performance aspects into product technical indicator requirements, and through core component design and independent synthesis, formulation development and optimization, and key process control to achieve adjustment and balance of technical indicators.