What is the difference between GOM,COB, and msd packages?

There has always been a constant topic and controversy about whether SMD and COB packaging processes is better or worse. This issue's industry veteran Colent also talked about it from the perspective of technology, industry and application.

SMD package

SMD is the abbreviation of Surface Mounted Devices, which means: Surface Mount Device. It is one of the SMT (Chinese: Surface Mount Technology) components. GOB packaging technology uses a special transparent material to package LED chips and substrates. This material has extremely high transparency and good thermal conductivity, and can effectively prevent moisture, water, dust, impact and UV. SMD + GOB packaging allows LED displays to work stably in various harsh environments.

cob packaging

The full name is Chips on Board. COB packaging is a packaging method different from SMD surface mount packaging technology. It is to attach the bare chip to the PCB with conductive or non-conductive glue, and then wire bonding is carried out to realize its electrical connection and glue the chip and bonding wires.

So, which is better than SMD + GOB or COB?

1. technology maturity

SMD technology is very mature, with many years of development history and extensive application foundation. This means that SMD's production processes, equipment and materials have been standardized to ensure product stability. However, due to process and production reasons, COB has to be technically accumulated and verified in the large-scale market.

2. show consistency

Due to its maturity and dichroic process, SMD packaging technology can usually provide better consistency, especially in terms of color and brightness, and the display effect is more uniform. However, some challenges still need to be solved in the actual production of COB. Although point-by-point correction technology has been introduced, the correction ability is limited. Therefore, the display consistency needs to be improved at the level of obtaining display color consistency.

3. less costly

Due to the widespread application and large-scale production of SMD technology, its production costs are relatively low. This makes SMD packaged LED products more price-competitive in the market, especially suitable for mass production and cost-sensitive application scenarios. The price of COB products with the same area and the same point spacing is about 20% more expensive than SMD, or even more.

4. Convenient maintenance

SMD packaged LED products can be replaced separately when damaged, and the maintenance process is relatively simple and does not require professional equipment, which reduces maintenance costs and improves product maintainability. The maintenance of COB products requires professional technicians and equipment. In addition, the maintenance of COB products may involve the replacement of the entire module rather than the replacement of a single chip, and the maintenance cost is high.

5. flexibility and diversity

SMD packaged LED products can be spliced independently and designed and customized according to different application needs, providing more flexibility.

6. Reliability and protection

Although the protective performance of SMD packages may not be as good as COB, its design can enhance protection through GOB to adapt to specific environmental requirements, and can also achieve the same dustproof, waterproof and anti-corrosion effects as COB products.

7. Industry applications and directions

Currently, 90% of screen manufacturers in the LED display industry are using SMD or SMD + GOB processes. In the future, MIP (Module in Package) processes achieve higher performance and functional integration by packaging multiple chips in the same device., it may be the preferred technical solution in the future. At the same time, MIP technology can be compatible with traditional SMT equipment, which helps LED display manufacturers accelerate their transformation and lower the threshold of industrialization. COB is sandwiched between SMD and MIP, and the pressure is great.

However, COB cannot be underestimated. Its advantages are as follows:

1. Higher brightness and uniformity

Because the LED chips are close to each other, COB can provide higher brightness and uniformity, making the display more vivid and clear.

2. Better heat management

COB's LED chips are directly soldered on the circuit board, which effectively improves the heat conduction efficiency, reduces the luminous temperature of the LED, and extends the service life of the LED.

3.Smaller package size

Since COB integrates multiple LED chips on one circuit board, the package size of the LED module can be significantly reduced and the overall performance and reliability of the display screen are improved.

4. Higher level of protection

COB uses hermetic packaging technology, making LED chips more durable and impact resistant, and can adapt to more stringent environmental conditions.

5. Energy conservation and environmental protection

COB has ultra-high light efficiency and can significantly reduce energy consumption compared to traditional lighting sources (such as incandescent lamps, fluorescent lamps, etc.). In addition, due to the long life of COBs, the frequency of replacing light sources can be reduced, thereby reducing the impact on the environment.

6. Excellent all-weather characteristics

Adopt triple protective treatment, with outstanding waterproof, moisture, corrosion, dust, static electricity, oxidation and ultraviolet effects, meeting all-weather working conditions.

Therefore, the advantages of SMD packaging technology lie in its maturity, consistency, cost-effectiveness, ease of maintenance, flexibility, wide application and standardized production processes, while GOB makes SMD protection even more powerful. These advantages make SMD still the preferred LED packaging technology in many application scenarios. As for COB, with the continuous development and improvement of technology, there may be more application scenarios in the future, especially where there are higher requirements for space utilization, thermal management and light quality, but the prerequisite is consistency, stability, and cost are well solved.