Reduced power consumption by 95%! Another Micro LED technology "refreshes" progress

According to South Korean media reports, the Korea Electronics and Telecommunications Research Institute (ETRI) has developed an advanced semiconductor chip packaging technology that can reduce semiconductor productionpower consumption by 95%.

ETRI researcher, source by ETRI

This new technology uses a new thin film material callednon-conductive thin film (NCF), developed by ETRI through its self-developed nanomaterial technology, made based on epoxy-based materials and reducing agents, and has a thickness range of10 to 20microns. This material has the high performance required for semiconductor packaging and can be used as a high-quality adhesive material.

In addition, ETRI develops packaging technology that can achieve high-precision processes, can be applied to various small chip packages, and can also be applied to the production of all high-end semiconductor products includingMicro LEDs.

It is worth noting that this accuracy can be achieved at room temperature, which is different from traditional methods that require heating to 100 ° C, resulting in higher power consumption, increased errors, and reduced reliability due to thermal expansion.

The ETRI research team revealed that severalMicro LED developers have participated in evaluating the new technology and achieved very positive preliminary test results. The new materialis expected to be commercially applied within three years, providing semiconductor display companies with low power consumption and environmentally friendly solutions.

In addition, the technology is expected to become a core material technology for manufacturing artificial intelligence semiconductors with high-performance requirements, such as semiconductors needed for autonomous driving and data centers.

It is reported that ETRI has also previously developed a SITRAB new material technology, which is the first technology to combine LED transfer and bonding processes into one.